SURFACE MOUNT ZENER DIODES

FEATURES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EUdirective)MECHANICAL DATA
• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.011 grams
• Packing informationT/R - 3K per 7" plastic Reel T/R - 10K per 13" plastic Reel