SURFACE MOUNT ZENER DIODES

FEATURES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATA
• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Mounting Position: Any