SURFACE MOUNT ZENER DIODES

FEATURES

Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS 2011/65/EU directive

MECHANICAL DATA

Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end