SURFACE MOUNT ZENER DIODES FEATURES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in comply with EU RoHS 2002/95/EC directives

  MECHANICAL DATA

• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Mounting Position: Any
• Polarity : Color band denotes cathode end